Lead-Free Electronics
Tuesday, November 30, 1:45–5:00 pm

Chair:  Mr. Gary Latta, Naval Surface Warfare Center – Crane Division and David Kayser, Naval Air Warfare Center – Aircraft DivisionKeynote:  Mr. Lloyd Condra, The Boeing Company

Throughout the electronics industry, lead has been a primary ingredient of finishes and solder in components and electrical attachment leads for more than 50 years. The health risks associated with lead are widely known. Though the majority of lead is recycled, approximately two percent can end up in landfills, primarily from consumable commercial electronic equipment. Recent directives and legislation issued both internationally as well as by several states in the United States have mandated the elimination of lead and other hazardous materials in some sectors of the electronics industry. Lead-free solders are now widely used in the commercial sector, but the growth of whiskers from these materials over extended periods of time, as well as the reduced resistance to shock and vibration, can cause early system failure. Electrical systems used in DoD and the aerospace sector are required to work properly for much longer periods of time than most consumer electronics so the higher failure rate in harsh environments is a significant concern. This session highlighted efforts to address the issues associated with lead-free electronics in DoD weapons and general aerospace systems.

START

END

TOPIC/TITLE

SPEAKER

ORGANIZATION

1:45 PM

1:55 PM

Welcome & Introduction by the Session Chair

Mr. Gary Latta

Naval Surface Warfare Center – Crane Division

1:55 PM

2:25 PM

KEYNOTE: Lead-Free Electronics: What's the Problem, Really?(Presentation – Abstract)

Mr. Lloyd Condra

The Boeing Company

2:25 PM

2:50 PM

Metal Whiskers: A Discussion of Risks and Mitigation(Presentation – Abstract)

Mr. Jay Brusse

Dell Perot Systems at NASA Goddard Space Flight Center

2:50 PM

3:15 PM

Lead-Free Challenges Facing DoD(Presentation – Abstract)

Mr. Gary Latta

3:15 PM

3:35 PM

Break

3:35 PM

4:00 PM

Lead-Free Research Activities and Gaps for Aerospace and Defense Systems(Presentation – Abstract)

Dr. Stephan Meschter

BAE Systems

4:00 PM

4:25 PM

Trends and Considerations Regarding Performance Testing of Pb-Free Assemblies: Focus on Aerospace and Defense Service/Usage Conditions(Presentation – Abstract)

Dr. Anthony Rafanelli

Raytheon Integrated Defense Systems

4:25 PM

4:50 PM

Issues Arising from Lead-Free Materials on Electronics Assemblies(Presentation – Abstract)

Dr. Michael Osterman

University of Maryland – CALCE Electronic Products and System Consortium

4:50 PM

5:00 PM

Discussion/Wrap-Up

Mr. Gary Latta