Lead-Free Electronics

Tin-lead (SnPb) solder historically has been the primary means of interconnection between electronic devices. SERDP and ESTCP projects are improving understanding of the role of Pb in inhibiting whisker growth, developing means for mitigating the risks associated with tin whiskers, and assessing the reliability of Pb-free alloys.

Active Projects List
Project Title Start Date

Tin Whiskers Inorganic Coatings Evaluation (TWICE)

Project Information
Project ID: WP-2212
Principal Investigator: Mr. David Hillman, Rockwell Collins, Inc.
SERDP Mar 2012

Novel Whisker Mitigating Composite Conformal Coat Assessment

Project Information
Project ID: WP-2213
Principal Investigator: Dr. Stephan Meschter, BAE Systems
SERDP Mar 2012

Tin Whisker Testing and Modeling

Project Information
Project ID: WP-1753
Principal Investigator: Dr. Stephan Meschter, BAE Systems
SERDP Jul 2010

The Role of Trace Elements in Tin Whisker Growth

Project Information
Project ID: WP-1751
Principal Investigator: Ms. Jean Nielsen, The Boeing Company
SERDP Jun 2010

Contributions of Stress and Oxidation on the Formation of Whiskers in Lead-Free Solders

Project Information
Project ID: WP-1754
Principal Investigator: Dr. Elizabeth Hoffman, Savannah River National Laboratory
SERDP Feb 2010

Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

Project Information
Project ID: WP-1752
Principal Investigator: Dr. Peter Borgesen, Binghamton University
SERDP Jan 2010