Lead-Free Electronics

Tin-lead (SnPb) solder historically has been the primary means of interconnection between electronic devices. SERDP and ESTCP projects are improving understanding of the role of Pb in inhibiting whisker growth, developing means for mitigating the risks associated with tin whiskers, and assessing the reliability of Pb-free alloys.

Active Projects List
Project Title Start Date

Enabling Lead-Free Interconnects in DoD Weapon Systems

Project Information
Project ID: WP-201573-T2
Principal Investigator: Dr. Stephan Meschter, BAE Systems
ESTCP Jun 2015

Novel Whisker Mitigating Composite Conformal Coat Assessment

Project Information
Project ID: WP-2213
Principal Investigator: Dr. Stephan Meschter, BAE Systems
SERDP Mar 2012

FY 2017 New Start Project Selections

FY 2017 New Start Project Selections for the Environmental Solicitation – SERDP; ESTCP

Pb-Free Electronics Risk Management Consortium (PERM)

 
DoD’s Chemical and Material Risk Management Directorate

 

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