- Program Areas
- Energy and Water
- Environmental Restoration
- Munitions Response
- Resource Conservation and Resiliency
- Weapons Systems and Platforms
Tin-lead (SnPb) solder historically has been the primary means of interconnection between electronic devices. SERDP and ESTCP projects are improving understanding of the role of Pb in inhibiting whisker growth, developing means for mitigating the risks associated with tin whiskers, and assessing the reliability of Pb-free alloys.
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